Manufacturing method of polishing layer, and polishing method
US10478940B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2017 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Dec 6, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2009/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A manufacturing method of a polishing layer is provided. First, a mold for which the mold cavity has a contour pattern is provided, and the cross section of the contour pattern along a direction includes a plurality of recessions and at least one concavity portion, wherein the at least one concavity portion is disposed on the bottom of at least one of the recessions. A polymer material is disposed in the mold cavity. The polymer material is cured to form a semifinished product, wherein the cross section of the semifinished product along the direction includes a plurality of polishing portions corresponding to the recessions and at least one protruding portion corresponding to the at least one concavity portion. A flattening process is performed on the semifinished product to remove the at least one protruding portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.