Reclaimable semiconductor device package and associated systems and methods
US10482988B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 16, 2017 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Nov 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Several embodiments of reclaimable semiconductor device packages and assemblies are disclosed herein. A semiconductor device assembly (100) includes a package (101) having a housing (102) and a package contact (104) arranged to receive a signal indicative of a reclamation state. A plurality of modules of semiconductor dies (106) are located within the housing and electrically coupled to the package contact (104). The dies (106) of the first and second modules dies are configured to store a module configuration state. The first and second modules (107a, 107b) are enabled for operation based, at least in part, on the reclamation state and the module configuration state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.