Patent · US Active

Warpage balancing in thin packages

US10483217B2 · kind B2 · utility

2Cited by

2References

21Claims

0Family size

Assignee

Invensas LLC · US

Inventors

Belgacem Haba · Cupertino, US
Sangil Lee · Santa Clara, US
Craig Mitchell · San Jose, US
Gabriel Z. Guevara · Gilroy, US
Javier A. Delacruz · San Jose, US

Key dates

Filing date	May 11, 2018
Grant date	Nov 19, 2019
Priority date	—
Expiry date	May 11, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Representative implementations of devices and techniques provide reinforcement for a carrier or a package. A reinforcement layer is added to a surface of the carrier, often a bottom surface of the carrier that is generally under-utilized except for placement of terminal connections. The reinforcement layer adds structural support to the carrier or package, which can be very thin otherwise. In various embodiments, the addition of the reinforcement layer to the carrier or package reduces warpage of the carrier or package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.