Patent · US Active

Integrated circuit (IC) devices with varying diameter via layer

US10483218B2 · kind B2 · utility

0Cited by
7References
20Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMay 31, 2019
Grant dateNov 19, 2019
Priority date—
Expiry dateMay 31, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/35121
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An integrated circuit (IC) device that includes an IC device layer, at least one electrical connection layer located over the IC device layer, and a varying diameter via layer located over the at least one electrical connection layer. The varying diameter via layer includes (i) an interior region having a plurality of interior region vias and (ii) a perimeter region having a plurality of perimeter region vias. The plurality of interior region vias of the interior region is larger than the plurality of perimeter region vias of the perimeter region. The varying diameter via layer comprises an interior surface that is coupled to an interior surface of the at least one electrical connection layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.