William Stone
21Patents
10h-index
28Co-inventors
75Inventor score
Filing activity: Nov 26, 1979 → Jun 4, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5644839A | Surface mountable substrate edge terminal | Emerging Cross-Sectional Technologies | 36 | Expired |
| US4346453A | Item display order picking system | Performing Operations; Transporting | 34 | Expired |
| US6019164A | Workpiece chuck | Emerging Cross-Sectional Technologies | 26 | Expired |
| US4677273A | Electron beam welding apparatus | Performing Operations; Transporting | 23 | Expired |
| US5509197A | Method of making substrate edge connector | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6328096A | Workpiece chuck | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5213649A | Apparatus for receiving and cutting a continuous web | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6700099B2 | Wafer chuck having thermal plate with interleaved heating and cooling elements, interchangeable top surface assemblies and hard coated layer surfaces | Electricity | 17 | Expired |
| US6375176B1 | Workpiece chuck with guard layer having vacuum distribution pattern | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6132583A | Shielding method and apparatus for use in electroplating process | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6744270B2 | Temperature-controlled thermal platform for automated testing | Electricity | 9 | Expired |
| US10002857B2 | Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer | Electricity | 9 | Active |
| US7331097B2 | Method of manufacturing a workpiece chuck | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6867611B2 | Temperature-controlled thermal platform for automated testing | Electricity | 3 | Expired |
| US5878975A | Winder rider roll assembly | Performing Operations; Transporting | 2 | Expired |
| US10347592B2 | Integrated circuit (IC) devices with varying diameter via layer | Electricity | 2 | Active |
| US9318405B2 | Wafer level package without sidewall cracking | Electricity | 1 | Active |
| US6969830B2 | Wafer chuck having thermal plate with interleaved heating and cooling elements | Electricity | 1 | Expired |
| US12218041B2 | Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods | Electricity | 0 | Active |
| US11784157B2 | Package comprising integrated devices coupled through a metallization layer | Electricity | 0 | Active |
| US10483218B2 | Integrated circuit (IC) devices with varying diameter via layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.