Silver-coated copper powder
US10486231B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Aug 17, 2016 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Aug 17, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12181
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A novel silver-coated copper powder, particularly a silver-coated copper powder particle having a dendritic shape, having increased electrical conductivity with no need to increase the silver content is provided. The silver-coated copper powder is composed of a silver-coated copper particle coated with a silver layer containing silver or a silver alloy, including a silver-coated copper particle having a dendritic shape, containing nitrogen (N) in the silver layer, and having a nitrogen (N) content of 0.2 to 10.0 parts by mass with respect to 100 parts by mass of the silver content.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.