Patent · US Active

Adhesion promoting process for metallisation of substrate surfaces

US10487404B2 · kind B2 · utility

5Cited by

4References

18Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Zhiming Liu · Englewood, US
Hailuo Fu · Westminster, US
Sara Hunegnaw · Denver, US
Lutz Brandt · Maintal, DE

Key dates

Filing date	Sep 22, 2014
Grant date	Nov 26, 2019
Priority date	—
Expiry date	Apr 20, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D5/50
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a metal oxide adhesion promoter which is activated and then metal plated. The method provides high adhesion of the non-conductive substrate to the plated metal layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.