Zhiming Liu
32Patents
10h-index
41Co-inventors
75Inventor score
Filing activity: Oct 26, 2001 → May 17, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10025379B2 | Eye tracking wearable devices and methods for use | Physics | 191 | Active |
| USD846913S1 | Inflatable neck pillow | General | 39 | Active |
| USD875438S1 | Pillow | General | 24 | Active |
| US7074519B2 | Molehole embedded 3-D crossbar architecture used in electrochemical molecular memory device | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6943054B2 | Attachment of organic molecules to group III, IV or V substrates | Emerging Cross-Sectional Technologies | 21 | Expired |
| US8529996B2 | High-temperature attachment of organic molecules to substrates | Emerging Cross-Sectional Technologies | 16 | Active |
| USD850155S1 | Multi-functional pillow | General | 14 | Active |
| US7452572B1 | Procedure for preparing redox-active polymers on surfaces | Electricity | 14 | Expired |
| USD898419S1 | Bone-conducted 3D massage pillow | General | 13 | Active |
| US7223628B2 | High temperature attachment of organic molecules to substrates | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7348206B2 | Formation of self-assembled monolayers of redox SAMs on silicon for molecular memory applications | Electricity | 10 | Expired |
| USD966743S1 | Massage pillow | General | 6 | Active |
| US10487404B2 | Adhesion promoting process for metallisation of substrate surfaces | Chemistry; Metallurgy | 5 | Active |
| US9345149B2 | Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards | Emerging Cross-Sectional Technologies | 4 | Active |
| US10508651B2 | Automatic inflation device | Mechanical Engineering; Lighting; Heating | 3 | Active |
| US8323769B2 | Methods of treating a surface to promote metal plating and devices formed | Emerging Cross-Sectional Technologies | 3 | Active |
| US9763336B2 | Methods of treating metal surfaces and devices formed thereby | Electricity | 1 | Active |
| US11520175B2 | Active region-less modulator and method | Physics | 1 | Active |
| US10844967B2 | Inflation system | Emerging Cross-Sectional Technologies | 1 | Active |
| US7230268B2 | Attachment of organic molecules to group III, IV or V substrates | Emerging Cross-Sectional Technologies | 1 | Expired |
| US10754093B2 | Fabrication process of polymer based photonic apparatus and the apparatus | Physics | 1 | Active |
| US9795040B2 | Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards | Emerging Cross-Sectional Technologies | 1 | Active |
| US10375835B2 | Methods of treating metal surfaces and devices formed thereby | Electricity | 1 | Active |
| US11506918B2 | Hybrid EO polymer modulator with ALD sealant layer | Physics | 0 | Active |
| US11085432B2 | Inflating device | Mechanical Engineering; Lighting; Heating | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.