Platinum temperature sensor element
US10488270B2 · kind B2 · utility
1Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2017 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Oct 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C7/06
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A temperature sensor element has such a structure as, when reinforcing lead wires on internal electrodes with a paste, one side surface of each of the lead wires is covered with a reinforcement paste and the other side surface is not covered with the reinforcement paste without covering the entire lead wires welded and connected to the internal electrodes. This allows elimination of cause of cracks generating, thereby securing sufficient joining strength and reinforcement of conductivity of the internal electrodes and the lead wires, and securing connection strength between the lead wires and the internal electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.