Apparatus for treating substrate
US10490427B2 · kind B2 · utility
6Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2015 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Dec 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treating apparatus is provided which includes a treating container of which a top end is opened, a substrate support unit placed in a treating container to support a substrate, a treatment solution supply unit supplying a treatment solution to a substrate put on the support unit, and a heating unit placed in the substrate support unit to heat the substrate. The heating unit includes a heating element and a reflection element reflecting a heat from the heating element upward.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.