Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same
US10490503B2 · kind B2 · utility
3Cited by
1References
26Claims
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Key dates
| Filing date | Mar 27, 2018 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Mar 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embedded multi-die interconnect bridge (EMIB) die is configured with power delivery to the center of the EMIB die and the power is distributed to two dice that are interconnected across the EMIB die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.