Cavity package with composite substrate
US10490510B2 · kind B2 · utility
0Cited by
88References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2017 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Aug 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/207
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.