Dipak Sengupta
15Patents
4h-index
22Co-inventors
56Inventor score
Filing activity: Nov 18, 1998 → Aug 7, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6534340B1 | Cover cap for semiconductor wafer devices | Electricity | 88 | Expired |
| US7871865B2 | Stress free package and laminate-based isolator package | Electricity | 20 | Active |
| US8723308B2 | Packages and methods for packaging using a lid having multiple conductive layers | Electricity | 9 | Active |
| US8538215B2 | Optical package and related methods | Electricity | 6 | Active |
| US8767982B2 | Microphone module with sound pipe | Electricity | 4 | Active |
| US9716193B2 | Integrated optical sensor module | Electricity | 3 | Active |
| US9142470B2 | Packages and methods for packaging | Electricity | 2 | Active |
| US8553834B2 | Computed tomography detector module | Human Necessities | 2 | Active |
| US10257610B2 | Microphone module with sound pipe | Electricity | 1 | Active |
| US10593634B2 | Packaged devices with integrated antennas | Electricity | 1 | Active |
| US10884551B2 | Integrated gesture sensor module | Emerging Cross-Sectional Technologies | 1 | Active |
| US9731959B2 | Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same | Electricity | 1 | Active |
| US9728510B2 | Cavity package with composite substrate | Electricity | 1 | Active |
| US10490510B2 | Cavity package with composite substrate | Electricity | 0 | Active |
| US9173015B2 | Microphone module with sound pipe | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.