Method and apparatus for laser machining
US10493559B2 · kind B2 · utility
4Cited by
65References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2009 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Oct 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2813
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser processing is enhanced by using endpointing or by using a charged particle beam together with a laser. End-pointing uses emissions, such as photons, electrons, ions, or neutral particles, from the substrate to determine when the material under the laser has changed or is about to change. Material removed from the sample can be deflected to avoid deposition onto the laser optics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.