Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
US10493592B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2017 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Feb 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturing apparatus according to the present embodiment has a polisher polishing a substrate. A holder holds the substrate and rotates the substrate with respect to the polisher while pressing the substrate toward the polisher. A supplier supplies a polishing solution onto the polisher. A first annular part is attached to the holder. The first annular part is located around the substrate and between the holder and the polisher, when polishing the substrate. A second annular part is attached to the holder. The second annular part is located around the first annular part and between the holder and the polisher, when polishing the substrate. The first annular part is movable relative to the second annular part or the second annular part is movable relative to the first annular part, in a rotation direction of the substrate or the holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.