Additive composition and positive polishing slurry composition including the same
US10494547B2 · kind B2 · utility
1Cited by
1References
9Claims
0Family size
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Key dates
| Filing date | Dec 15, 2016 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Dec 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An additive composition and a positive polishing slurry composition including the additive composition are provided. The additive composition includes a cationic compound, an organic acid, a nonionic compound, and a pH adjuster.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.