Method of forming an optically-finished thin diamond film, diamond substrate, or diamond window of high aspect ratio

US10494713B2 · kind B2 · utility

Assignee

• II-VI Incorporated · US

Inventors

• Wen-Qing Xu · Sarver, US
• Thomas E. Anderson · Normal, US
• Giovanni Barbarossa · Saratoga, US
• Elgin E. Eissler · Renfrew, US
• Chao Liu · Butler, US
• Charles D. Tanner · Hannahstown, US

Key dates

• Filing date: Apr 7, 2016
• Grant date: Dec 3, 2019
• Expiry date: Jun 1, 2036

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/30
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

In a method of forming a diamond film, diamond substrate, or diamond window, a silicon substrate is provided and the diamond film, diamond substrate, or diamond window is CVD grown on a surface of the silicon substrate. The grown diamond film, diamond substrate, or diamond window has an aspect ratio ≥100, wherein the aspect ratio is a ratio of a largest dimension of the diamond film, diamond substrate, or diamond window divided by a thickness of the diamond film, diamond substrate, or diamond window. The silicon substrate has a thickness greater than or equal to 2 mm. The silicon substrate can optionally be removed or separated from the grown diamond film, diamond substrate, or diamond window.