Patent · US Active

Method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath and controlled process for plating

US10494732B2 · kind B2 · utility

0Cited by

2References

15Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Mutlu-Iskender Muglali · Berlin, DE
Torsten Voss · Glienicke, DE
Andreas Kirbs · Berlin, DE

Key dates

Filing date	May 17, 2017
Grant date	Dec 3, 2019
Priority date	—
Expiry date	May 17, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG01N27/4166
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating process, a controlled process for electrolytically depositing copper/copper alloy onto a substrate utilizing the method for monitoring according to the present invention, and the use of one or more than one redox active compound for monitoring and/or determining the total amount of brighteners in the acidic copper/copper alloy plating bath.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.