Andreas Kirbs
6Patents
1h-index
26Co-inventors
43Inventor score
Filing activity: May 29, 2009 → May 17, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9551080B2 | Copper plating bath composition | Electricity | 8 | Active |
| US10753007B2 | Process for indium or indium alloy deposition and article | Chemistry; Metallurgy | 0 | Active |
| US8828278B2 | Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)—group 13 (IIIA)—Group 16 (VIA) | Emerging Cross-Sectional Technologies | 0 | Active |
| US10494732B2 | Method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath and controlled process for plating | Physics | 0 | Active |
| US10793962B2 | Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy | Chemistry; Metallurgy | 0 | Active |
| US11761090B2 | Method for monitoring the total amount of sulphur containing compounds in a metal plating bath | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.