System and method for determining if deterioration occurs in interface of semiconductor die of electric power module
US10495681B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2016 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Nov 1, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2697
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention concerns a system for determining if a deterioration occurs in an interface of a semiconductor die of an electric power module, the electric power module further comprising a substrate and at least one electromechanical transductor, the semiconductor die and the at least one electromechanical transductor being placed on or embedded within the substrate, wherein the system comprises: —means for transferring at least one electric signal to the at least one electromechanical transductor, —means for measuring the impedance of the at least one electromechanical transductor, —means for comparing the impedance of the at least one electromechanical transductor to a predetermined value, —means for deciding that the deterioration occurs in the interface of the semiconductor die according to the comparison result.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.