Patent · US Active

Devices with slotted active regions

US10497576B1 · kind B1 · utility

0Cited by
2References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 20, 2018
Grant dateDec 3, 2019
Priority date
Expiry dateAug 20, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D30/798
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present disclosure relates to semiconductor structures and, more particularly, to devices with slotted active regions and methods of manufacture. The method includes: forming a mandrel on top of a diffusion region comprising a diffusion material; forming a first material over the mandrel and the diffusion region; removing the mandrel to form multiple spacers each having a thickness; depositing a second material over the spacers and the diffusion material; and forming slots in the diffusion region by removing a portion of the second material over the diffusion region and the underlying diffusion material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.