Microelectronic conductive routes and methods of making the same

US10497613B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Jasmeet S. Chawla · Hillsboro, US
• Rami Hourani · Santa Clara, US
• Mauro J. Kobrinsky · Portland, US
• Florian Gstrein · Portland, US
• Scott B. Clendenning · Portland, US
• Jeanette M. Roberts · North Plains, US

Key dates

• Filing date: Apr 29, 2015
• Grant date: Dec 3, 2019
• Expiry date: Apr 29, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2221/1063
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A conductive route structure may be formed comprising a conductive trace and a conductive via, wherein the conductive via directly contacts the conductive trace. In one embodiment, the conductive route structure may be formed by forming a dielectric material layer on the conductive trace. A via opening may be formed through the dielectric material layer to expose a portion of the conductive trace and a blocking layer may be from only on the exposed portion of the conductive trace. A barrier line may be formed on sidewalls of the via opening and the blocking layer may thereafter be removed. A conductive via may then be formed within the via opening, wherein the conductive via directly contacts the conductive trace.