Stacked circuit package with molded base having laser drilled openings for upper package

US10497635B2 · kind B2 · utility

Assignee

• Linear Technology Holding LLC · US

Inventors

• John David Brazzle · Tracy, US
• Frederick E. Beville · San Jose, US
• David R. Ng · San Jose, US
• Michael J. Anderson · Phoenix, US
• Yucheng Ying · San Jose, US

Key dates

• Filing date: Oct 4, 2018
• Grant date: Dec 3, 2019
• Expiry date: Oct 4, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/4853
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A stacked package configuration is described that includes a bottom package and an upper package. The bottom package includes a substrate having a top surface with first circuitry and metal first pads. A molded layer is then formed over the substrate. Holes through the molded layer are then laser drilled to expose the first pads. The holes and first pads align with leads of an upper package, which contains further circuit components. The holes are then partially filled with a solder paste. A thermal epoxy is applied between the molded layer and the upper package. The leads of the upper package are then inserted into the holes, and the solder paste is reflowed to electrically, thermally, and mechanically connect the upper package to the bottom package. The reflow heat also cures the epoxy. A ball grid array is then formed on the bottom of the substrate.