Frederick E. Beville
5Patents
2h-index
9Co-inventors
40Inventor score
Filing activity: May 4, 2010 → Sep 25, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10497635B2 | Stacked circuit package with molded base having laser drilled openings for upper package | Electricity | 4 | Active |
| US11272618B2 | Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits | Electricity | 2 | Active |
| US11410977B2 | Electronic module for high power applications | Electricity | 2 | Active |
| US8163643B1 | Enhanced pad design for solder attach devices | Electricity | 1 | Active |
| US11749576B2 | Stacked circuit package with molded base having laser drilled openings for upper package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.