Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure
US10497651B2 · kind B2 · utility
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32References
23Claims
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Key dates
| Filing date | Oct 31, 2017 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Oct 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. An electromagnetic interference (EMI) shield is provided by a photonic bandgap (PBG) structure that is included within the encapsulation material. The PBG structure is configured to have a photonic bandgap with a frequency range approximately equal to a range of frequencies that may cause EMI.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.