Patent · US Active

Semiconductor package assembly with passive device

US10497678B2 · kind B2 · utility

0Cited by

4References

2Claims

0Family size

Assignee

MEDIATEK INC. · TW

Inventors

Che-Hung Kuo · Hsinchu, TW
Ying-Chih Chen · Danei, TW
Che-Ya Chou

Key dates

Filing date	Oct 6, 2017
Grant date	Dec 3, 2019
Priority date	—
Expiry date	Oct 6, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package assembly includes a first substrate. A first semiconductor die is disposed on the first substrate. A passive device is located directly on the first semiconductor die. The passive device is disposed within a boundary of the first semiconductor die in a plan view.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.