Thermal head with a thermal barrier for integrated circuit die processing
US10499461B2 · kind B2 · utility
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5References
13Claims
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Key dates
| Filing date | Dec 21, 2015 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Jan 21, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2875
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal heat for integrated circuit die processing is described that includes a thermal barrier. In one example, the thermal head has a ceramic heater configured to carry an integrated circuit die, a metal base, and a thermal barrier between the heater and the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.