Semiconductor memory device
US10503685B2 · kind B2 · utility
1Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 31, 2016 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Apr 1, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2213/0042
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a semiconductor memory device includes a first tube, a case, a substrate, a memory, a controller, and a first layer. The case is connected to the first tube. The substrate includes a first portion inside the first tube. The first layer covers an inner face of the first tube, is interposed between the first portion and the first tube, and has a thermal conductivity higher than a thermal conductivity of the first tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.