Multilayer ceramic electronic component
US10504653B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2018 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Oct 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/248
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending in a thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.