Patent · US Active

Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method

US10504753B2 · kind B2 · utility

0Cited by

9References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Chang-Sheng Lin · Hsinchu, TW
Hsin-Hsien Lu · Hsinchu, TW

Key dates

Filing date	Dec 13, 2013
Grant date	Dec 10, 2019
Priority date	—
Expiry date	Oct 17, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67051
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A brush cleaning apparatus includes a wafer support configured to support a wafer, and at least one cleaning brush moveable relative to the wafer support. The at least one cleaning brush has opposite first and second sides, and, on the first side, a planar cleaning surface configured to come into contact with the wafer supported by the wafer support to remove contaminants from the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.