Inventor · Hsinchu, TW

Hsin-Hsien Lu

29Patents
6h-index
30Co-inventors
65Inventor score

Filing activity: Jul 29, 2002 → May 3, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US6677251B1 Method for forming a hydrophilic surface on low-k dielectric insulating layers for improved adhesion Electricity 81 Expired
US6962869B1 SiOCH low k surface protection layer formation by CxHy gas plasma treatment Electricity 49 Expired
US8889544B2 Dielectric protection layer as a chemical-mechanical polishing stop layer Electricity 7 Active
US9415479B2 Conductive chemical mechanical planarization polishing pad Performing Operations; Transporting 6 Active
US8252682B2 Method for thinning a wafer Electricity 6 Active
US8921150B2 Process to achieve contact protrusion for single damascene via Electricity 6 Active
US8828875B1 Method and apparatus for improving CMP planarity Electricity 6 Active
US6770570B2 Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer Electricity 5 Expired
US9434047B2 Retainer ring Performing Operations; Transporting 2 Active
US9576789B2 Apparatus, method, and composition for far edge wafer cleaning Electricity 2 Active
US9601409B2 Protruding contact for integrated chip Electricity 2 Active
US8021566B2 Method for pre-conditioning CMP polishing pad Performing Operations; Transporting 2 Active
US9597771B2 Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system Performing Operations; Transporting 2 Active
US8348719B2 Polisher for chemical mechanical planarization Performing Operations; Transporting 1 Active
US9287127B2 Wafer back-side polishing system and method for integrated circuit device manufacturing processes Electricity 1 Active
US9559021B2 Wafer back-side polishing system and method for integrated circuit device manufacturing processes Electricity 1 Active
US9466501B2 Method and apparatus for improving CMP planarity Electricity 1 Active
US10998184B2 Apparatus and method for wafer cleaning Electricity 0 Active
US7105446B2 Apparatus for pre-conditioning CMP polishing pad Performing Operations; Transporting 0 Expired
US10734254B2 Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method Electricity 0 Active
US10770314B2 Semiconductor device, tool, and method of manufacturing Electricity 0 Active
US10504753B2 Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method Electricity 0 Active
US11705324B2 Apparatus and method for wafer cleaning Electricity 0 Active
US10377013B2 Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system Performing Operations; Transporting 0 Active
US9852899B2 Wafer back-side polishing system and method for integrated circuit device manufacturing processes Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.