Mechanisms for forming bonding structures
US10504870B2 · kind B2 · utility
0Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2017 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Sep 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.