Radio frequency device packages and methods of formation thereof

US10505255B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Ashutosh Baheti · Munich, DE
• Saverio Trotta · Hersbruck, DE
• Werner Reiss · Bad Feilnbach, DE

Key dates

• Filing date: Jan 30, 2017
• Grant date: Dec 10, 2019
• Expiry date: Sep 28, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/73204
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

A semiconductor device package includes a radio frequency front end circuit configured to process radio frequency signals, a first antenna, an antenna substrate, and a first conductive barrier. The first antenna is configured to transmit/receive a first radio frequency signal. The antenna substrate includes the first antenna. The antenna substrate is configured to transfer the first radio frequency signal between the radio frequency front end circuit and the first antenna. The first conductive barrier is configured to electromagnetically and electrostatically isolate the first antenna.