Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrate
US10508207B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2016 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Jan 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0329
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions. The acid is typically a high molecular weight polymeric acid having molecular weight of at least 500,000 Da including, for example, polystyrene sulfonic acid having a molecular weight of approximately 1,000,000 Da.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.