Patent assignee · US · COMPANY

MacDermid Enthone Inc.

38Patents
38Active
38Granted
53Portfolio score

Filing activity: May 24, 2011 → Sep 6, 2023

Most-cited patents

PatentTitleAreaCited byStatus
US11035048B2 Cobalt filling of interconnects Electricity 3 Active
US10519557B2 Leveler compositions for use in copper deposition in manufacture of microelectronics Electricity 2 Active
US10103029B2 Process for filling vias in the microelectronics Electricity 1 Active
US11124888B2 Copper deposition in wafer level packaging of integrated circuits Electricity 0 Active
US12398480B2 Leveler compositions for use in copper deposition in manufacture of microelectronics Chemistry; Metallurgy 0 Active
US11168406B2 Leveler compositions for use in copper deposition in manufacture of microelectronics Electricity 0 Active
US11873568B2 Compositions and methods for the electrodeposition of nanotwinned copper Performing Operations; Transporting 0 Active
US10294574B2 Levelers for copper deposition in microelectronics Chemistry; Metallurgy 0 Active
US11434578B2 Cobalt filling of interconnects in microelectronics Chemistry; Metallurgy 0 Active
US11643742B2 Silver/tin electroplating bath and method of using the same Electricity 0 Active
US11015255B2 Selective plating of three dimensional surfaces to produce decorative and functional effects Performing Operations; Transporting 0 Active
US12270121B2 Composition and method for fabrication of nickel interconnects Electricity 0 Active
US12157944B2 Method and wet chemical compositions for diffusion barrier formation Electricity 0 Active
US11230778B2 Cobalt chemistry for smooth topology Emerging Cross-Sectional Technologies 0 Active
US12325927B2 Complex waveform for electrolytic plating Electricity 0 Active
US10443135B1 Near neutral pH pickle on multi-metals Chemistry; Metallurgy 0 Active
US10828668B2 Textured hardcoat films Performing Operations; Transporting 0 Active
US11174555B2 Chromium-free plating-on-plastic etch Chemistry; Metallurgy 0 Active
USRE49202E1 Copper electrodeposition in microelectronics General 0 Active
US10081876B2 Aqueous electrolyte composition having a reduced airborne emission, method and use of this composition Chemistry; Metallurgy 0 Active
US10941496B2 Near neutral pH pickle on multi-metals Chemistry; Metallurgy 0 Active
US10865495B2 Multicorrosion protection system for decorative parts with chrome finish Emerging Cross-Sectional Technologies 0 Active
US10995417B2 Cobalt filling of interconnects in microelectronics Chemistry; Metallurgy 0 Active
US11697884B2 Copper deposition in wafer level packaging of integrated circuits Electricity 0 Active
US10508207B2 Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrate Electricity 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.