Polyimide-based polymer thick film resistor composition
US10508217B2 · kind B2 · utility
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1References
7Claims
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Assignee
Inventor
Key dates
| Filing date | Dec 3, 2018 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Dec 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/06586
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.