Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
US10508349B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jun 13, 2017 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Sep 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/205
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.