Systems, apparatus, and methods for purging a substrate carrier at a factory interface

US10510570B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Subramaniam V. Iyer · Jamkhed, IN
• Dharma Ratnam Srichurnam · Hyderabad, IN
• Devendrappa Holeyannavar · Bengaluru, IN
• Douglas MacLeod · Los Altos, US
• Kenneth Carpenter · San Diego, US
• Naveen Kumar · Bengaluru, IN
• Vivek R. Rao · Bengaluru, IN
• Patrick D. Pannese · Lynnfield, US

Key dates

• Filing date: Oct 22, 2015
• Grant date: Dec 17, 2019
• Expiry date: Sep 10, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67772
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present invention provide systems, apparatus, and methods for purging a substrate carrier. Embodiments include a frame configured to sit proximate to a load port door without interfering with operation of a factory interface or equipment front end module robot; one or more inter-substrate nozzle arrays supported by the frame and configured to spray gas into a substrate carrier; and one or more curtain nozzle arrays supported by the frame and configured to spray gas across an opening of the substrate carrier. Numerous additional aspects are disclosed.