Fan-out package having a main die and a dummy die, and method of forming
US10510674B2 · kind B2 · utility
15Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2018 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Dec 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a package and a package are provided. The method includes placing a main die and a dummy die side by side on a carrier substrate. The method also includes forming a molding material along sidewalls of the main die and the dummy die. The method also includes forming a redistribution layer comprising a plurality of vias and conductive lines over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die. The method also includes removing the carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.