PoP device and method of forming the same
US10510732B2 · kind B2 · utility
3Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2017 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Jan 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a PoP device and a method of manufacturing the same. The PoP device includes a first package structure and a second package structure. The first package structure includes a die, a through integrated fan-out via (TIV), an encapsulant, and a film. The TIV is aside the die. The encapsulant encapsulates sidewalls of the die and sidewalls of the TIV. The film is over the TIV and the encapsulant, and aside the die. The second package structure is connected to the first package structure through a connector. The connector penetrates through the film to electrically connected to the TIV.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.