Integrated device comprising embedded package on package (PoP) device
US10510733B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2018 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Nov 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device that includes a printed circuit board (PCB), a package on package (PoP) device, a first encapsulation layer, and a second encapsulation layer. The package on package (PoP) device is coupled to the printed circuit board (PCB). The package on package (PoP) device includes a first package having a first electronic package component, a second package coupled to the first package, a gap controller configured to provide a spacing between the first electronic package component and the second package. The gap controller includes a spacer and an adhesive layer. The first encapsulation layer is formed between the first package and the second package. The first encapsulation layer is configured to at least partially encapsulate the gap controller including the spacer and the adhesive layer. The second encapsulation layer is configured to at least partially encapsulates the package on package (PoP) device. The device is configured to provide cellular functionality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.