Milind Shah
44Patents
7h-index
58Co-inventors
72Inventor score
Filing activity: Nov 4, 2003 → Apr 19, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7451539B2 | Method of making a conformal electromagnetic interference shield | Emerging Cross-Sectional Technologies | 68 | Expired |
| US6996892B1 | Circuit board embedded inductor | Emerging Cross-Sectional Technologies | 42 | Expired |
| US9379090B1 | System, apparatus, and method for split die interconnection | Electricity | 30 | Active |
| US8434220B2 | Heat sink formed with conformal shield | Emerging Cross-Sectional Technologies | 25 | Active |
| US8062930B1 | Sub-module conformal electromagnetic interference shield | Electricity | 25 | Expired |
| US9137934B2 | Compartmentalized shielding of selected components | Emerging Cross-Sectional Technologies | 11 | Active |
| US8296941B2 | Conformal shielding employing segment buildup | Emerging Cross-Sectional Technologies | 10 | Active |
| US9806063B2 | Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability | Electricity | 7 | Active |
| US6884661B1 | Method of fabricating posts over integrated heat sink metallization to enable flip chip packaging of GaAs devices | Electricity | 5 | Expired |
| US10510733B2 | Integrated device comprising embedded package on package (PoP) device | Electricity | 5 | Active |
| US7999197B1 | Dual sided electronic module | Electricity | 4 | Active |
| US9484327B2 | Package-on-package structure with reduced height | Electricity | 4 | Active |
| US8093982B2 | Three dimensional inductor and transformer design methodology of glass technology | Electricity | 4 | Active |
| US7474189B1 | Circuit board embedded inductor | Emerging Cross-Sectional Technologies | 3 | Expired |
| US9131634B2 | Radio frequency package on package circuit | Emerging Cross-Sectional Technologies | 3 | Active |
| US9269681B2 | Surface finish on trace for a thermal compression flip chip (TCFC) | Electricity | 3 | Active |
| US8847375B2 | Microelectromechanical systems embedded in a substrate | Electricity | 3 | Active |
| US11239573B2 | Sub-module L-shaped millimeter wave antenna-in-package | Electricity | 2 | Active |
| US8633597B2 | Thermal vias in an integrated circuit package with an embedded die | Electricity | 2 | Active |
| US9466578B2 | Substrate comprising improved via pad placement in bump area | Electricity | 2 | Active |
| US11101228B1 | Integrated circuit package with a magnetic core | Emerging Cross-Sectional Technologies | 1 | Active |
| US11652101B2 | Trench capacitor assembly for high capacitance density | Electricity | 1 | Active |
| US11201127B2 | Device comprising contact to contact coupling of packages | Electricity | 1 | Active |
| US8802556B2 | Barrier layer on bump and non-wettable coating on trace | Electricity | 1 | Active |
| US7732253B1 | Flip-chip assembly with improved interconnect | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.