Patent · US Active

Method of filling through-holes to reduce voids and other defects

US10512174B2 · kind B2 · utility

0Cited by
14References
8Claims
0Family size

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Key dates

Filing dateDec 20, 2016
Grant dateDec 17, 2019
Priority date—
Expiry dateDec 20, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/0723
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by electroplating at a lower current density to fill through-holes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.