Apparatus and techniques for electronic device encapsulation
US10512931B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2017 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Jan 31, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D11/101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and techniques for use in manufacturing a light emitting device, such as an organic light emitting diode (OLED) device can include using one or more modules having a controlled environment. The controlled environment can be maintained at a pressure at about atmospheric pressure or above atmospheric pressure. The modules can be arranged to provide various processing regions and to facilitate printing or otherwise depositing one or more patterned organic layers of an OLED device, such as an organic encapsulation layer (OEL) of an OLED device. In an example, uniform support for a substrate can be provided at least in part using a gas cushion, such as during one or more of a printing, holding, or curing operation comprising an OEL fabrication process. In another example, uniform support for the substrate can be provided using a distributed vacuum region, such as provided by a porous medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.