Alexander Sou-Kang Ko
94Patents
12h-index
40Co-inventors
84Inventor score
Filing activity: Mar 2, 2000 → May 16, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8899171B2 | Gas enclosure assembly and system | Electricity | 34 | Active |
| US9048344B2 | Gas enclosure assembly and system | Emerging Cross-Sectional Technologies | 27 | Active |
| US9278564B2 | Gas enclosure systems and methods utilizing multi-zone circulation and filtration | Electricity | 25 | Active |
| US9387709B2 | Gas enclosure assembly and system and related printing maintenance methods | Emerging Cross-Sectional Technologies | 25 | Active |
| US9352561B2 | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances | Performing Operations; Transporting | 23 | Active |
| US9802403B2 | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances | Performing Operations; Transporting | 20 | Active |
| US9873273B2 | Gas enclosure systems and methods utilizing multi-zone circulation and filtration | Electricity | 19 | Active |
| US9343678B2 | Apparatus and techniques for electronic device encapsulation | Chemistry; Metallurgy | 18 | Active |
| US9961782B2 | Transport path correction techniques and related systems, methods and devices | Electricity | 17 | Active |
| US9579905B2 | Apparatus and techniques for electronic device encapsulation | Chemistry; Metallurgy | 14 | Active |
| US9505245B2 | Printing system assemblies and methods | Electricity | 12 | Active |
| US10537911B2 | Gas cushion apparatus and techniques for substrate coating | Electricity | 12 | Active |
| US9884501B2 | Printing system assemblies and methods | Electricity | 12 | Active |
| US6612014B1 | Dual post centrifugal wafer clip for spin rinse dry unit | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7334588B2 | Method and apparatus for wafer cleaning | Emerging Cross-Sectional Technologies | 8 | Active |
| US10414181B2 | Printing system assemblies and methods | Electricity | 6 | Active |
| US6499333B1 | Calibration element for adjustment nozzle | Electricity | 6 | Expired |
| US10654299B2 | Low-particle gas enclosure systems and methods | Electricity | 5 | Active |
| US9034428B2 | Face-down printing apparatus and method | Electricity | 3 | Active |
| US6688155B2 | Calibration element for adjustable nozzle | Electricity | 3 | Expired |
| US7451774B2 | Method and apparatus for wafer cleaning | Emerging Cross-Sectional Technologies | 3 | Expired |
| US11135835B2 | Ejection control using substrate alignment features and print region alignment features | Performing Operations; Transporting | 3 | Active |
| US8714719B2 | Printhead unit assembly for use with an inkjet printing system | Performing Operations; Transporting | 3 | Active |
| US10784470B2 | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances | Electricity | 2 | Active |
| US7819985B2 | Method and apparatus for wafer cleaning | Emerging Cross-Sectional Technologies | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.