Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same
US10513605B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2016 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Sep 14, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L61/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.