Amalgamated cover ring
US10515843B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2016 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Jan 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure generally relates to generally relates to equipment for performing semiconductor device fabrication, and more particularly, to a cover ring for partially covering a surface of a substrate support in high-density plasma chemical vapor deposition processing. In one embodiment, the cover ring may include an annular body, an inner support block with a beveled first edge for stability, one or more thermal breaks to increase thermal movement towards the outer diameter, a rounded shoulder to prevent particle deposition, an outer lip configured to a substrate support pedestal, a vertical appendage to support the substrate, and a thermally conductive coating disposed on the annular ring to direct thermal conductivity towards the outer edge of the ring and prevent particle accumulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.