Fan-out package structure having stacked carrier substrates and method for forming the same
US10515887B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2017 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Sep 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package structure is provided. The semiconductor package structure includes a first carrier substrate having a first surface and an opposing second surface. A second carrier substrate is stacked on the first carrier substrate and has a first surface and an opposing second surface that faces the first surface of the first carrier substrate. A semiconductor die is mounted on the first surface of the second carrier substrate. A heat spreader is disposed on the first surface of the first carrier substrate to cover and surround the second carrier substrate and the semiconductor die. A method for forming the semiconductor package structure is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.