Nan-Cheng Chen
32Patents
6h-index
49Co-inventors
65Inventor score
Filing activity: Jun 11, 2007 → Jan 17, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8093722B2 | System-in-package with fan-out WLCSP | Electricity | 46 | Active |
| US7786557B2 | QFN Semiconductor package | Electricity | 29 | Active |
| US7838975B2 | Flip-chip package with fan-out WLCSP | Electricity | 24 | Active |
| US8310051B2 | Package-on-package with fan-out WLCSP | Electricity | 12 | Active |
| US10847869B2 | Semiconductor package having discrete antenna device | Electricity | 7 | Active |
| US9165877B2 | Fan-out semiconductor package with copper pillar bumps | Electricity | 6 | Active |
| US8044496B2 | QFN semiconductor package | Electricity | 6 | Active |
| US9158880B2 | Layout method for printed circuit board | Physics | 3 | Active |
| US11675856B2 | Product features map | Physics | 2 | Active |
| US10128192B2 | Fan-out package structure | Electricity | 2 | Active |
| US11322823B2 | Antenna-in-package with frequency-selective surface structure | Electricity | 2 | Active |
| US10680727B2 | Over the air wireless test system for testing microelectronic devices integrated with antenna | Physics | 2 | Active |
| US10515887B2 | Fan-out package structure having stacked carrier substrates and method for forming the same | Electricity | 2 | Active |
| US8525310B2 | Leadframe package for high-speed data rate applications | Electricity | 2 | Active |
| US8283757B2 | Quad flat package with exposed common electrode bars | Electricity | 2 | Active |
| US10103128B2 | Semiconductor package incorporating redistribution layer interposer | Electricity | 2 | Active |
| US10784206B2 | Semiconductor package | Electricity | 2 | Active |
| US10991669B2 | Semiconductor package using flip-chip technology | Emerging Cross-Sectional Technologies | 2 | Active |
| US8039933B2 | QFN semiconductor package | Electricity | 2 | Active |
| US9846756B2 | Layout method for printed circuit board | Physics | 1 | Active |
| US9331054B2 | Semiconductor package assembly with decoupling capacitor | Electricity | 1 | Active |
| US9674941B2 | Printed circuit board for mobile platforms | Electricity | 1 | Active |
| US11373957B2 | Semiconductor package with layer structures, antenna layer and electronic component | Electricity | 1 | Active |
| US11848481B2 | Antenna-in-package with frequency-selective surface structure | Electricity | 0 | Active |
| US11721882B2 | Semiconductor package having discrete antenna device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.