Integrated circuit packages

US10515912B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Min Suet Lim · Kampung Bukit Kechil, MY
• Jiun Hann Sir · Air Itam, MY
• Eng Huat Eh Goh · Bukit Mertajam, MY
• Mooi Ling Chang · Bayan Lepas, MY

Key dates

• Filing date: Sep 24, 2017
• Grant date: Dec 24, 2019
• Expiry date: Sep 24, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/18162
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Substrateless integrated circuit (IC) packages having a die with direct diagonal connections, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, an IC package may include: a die having a face with a plurality of contacts thereon, a dielectric layer in contact with the face, and a conductive pathway extending diagonally through the dielectric layer and coupling to an individual contact of the plurality of contacts on the die. In some embodiments, a conductive pathway may fan out to translate the contacts from a more dense layout to a less dense layout. In some embodiments, a conductive pathway may fan in to translate the contacts from a less dense layout to a more dense layout. In some embodiments, the dielectric layer and the conductive pathway may extend beyond the footprint of the die on one or more edges.